Quartz Wafer

Quartz Wafer


Quartz Wafer


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Product Overview
 
Felix Glass is a professional custom quartz wafer manufacturer and OEM optical quartz fabrication supplier, supplying semiconductor grade precision optical quartz components for photolithography equipment manufacturers, MEMS R&D labs and mask production factories globally.
 
Our quartz wafers are fabricated from 99.99% high purity fused silica with JGS1/JGS2/JGS3 material grades, available in single-side polished (SSP) and double-side polished (DSP) finishes. Featuring ultra-low CTE, low TTV, excellent deep UV transmission and low outgassing performance, these precision wafer substrates are core carriers for photomasks, semiconductor lithography, micro-electromechanical systems and UV inspection equipment.
We support full custom diameter, ultra-thin thickness, edge chamfer and AR coating processing, fully compliant with semiconductor industrial standards and ISO 9001 quality inspection, covering lab prototype sampling to large-scale OEM mass production.




Product Specifications 


ParameterSpecification
Material99.99% High‑Purity Fused Silica (JGS1/JGS2/JGS3)
Standard Diameter2”, 3”, 4”, 6”, 8”, 12”, custom sizes available
Thickness0.1mm–6.35mm ultra-thin customizable
Surface PolishSSP Single Side Polished / DSP Double Side Polished
Surface Quality60/40, 40/20, 20/10 MIL optical finish
Flatnessλ/2, λ/4, λ/10 @632.8nm
Transmission Range185nm–3500nm deep UV to infrared
Operating TemperatureUp to 1100°C continuous working
CTE5.5×10⁻⁷ /°C ultra-low thermal expansion
TTV≤3μm ultra-low total thickness variation
ToleranceDiameter ±0.05mm, thickness ±0.02mm
CustomizationEdge chamfer, AR coating, marking, special profiling


Key Features 

✓ Ultra-Low TTV Double-Side Polished Semiconductor Wafer
✓ Superior Deep UV Transmittance for Photolithography Masks
✓ Low Outgassing & High Purity for Vacuum Semiconductor Process
✓ Ultra-Low CTE Ensures Stable Optical Precision
✓ SSP & DSP Dual Polishing Options for Different Processes
✓ Low MOQ Prototypes & Large Batch OEM Mass Production



Manufacturing Capabilities 

1. Full‑Axis CNC Machining for complex outlines & holes
2. Precision Edge Grinding & Safety Chamfer Processing
3. Single & Double Sided Ultra‑Fine Optical Polishing
4. High‑Temperature Tempering & Stress Relief Treatment
5. Magnetron Sputtering Multi‑Layer Optical Coating
6. Complete Optical Performance Lab Inspection

  2. View Full Production Capacity



Available Material Grades 

1. JGS1 Deep UV Grade – Exclusive for photomask & UV lithography
2. JGS2 UV‑Vis Grade – General optical MEMS substrate
3. JGS3 IR Grade – Infrared detection wafer substrate
4. 99.99% Semiconductor Ultra-Pure Fused Silica – Standard production wafer


Main Application Industries

1. Semiconductor Photolithography Photomask Substrates
2. MEMS Micro-Electromechanical System Chips
3. UV Exposure & Wafer Inspection Equipment
4. High-Precision Optical Metrology Instruments
5. Aerospace UV Optical Sensing Components
6. Laboratory Spectroscopy & Electrochemical Testing
7. Photovoltaic Silicon Wafer Detection Equipment
8. Microfluidic Chip & Biomedical Analytical Devices


Custom Manufacturing Service 

1. Full OEM & ODM one‑stop optical glass customization
2. Small prototype sample orders supported before mass production
3. Ultra‑low MOQ for laboratory & R&D startup clients
4. Free technical drawing evaluation & customized solution design
5. Custom coating, printing, shaping and hole layout processing

Why Choose Felix Glass 

1. 19+ years professional fused silica optical glass manufacturing experience
2. ISO 9001 certified full factory quality control system
3. Independent optical testing laboratory for all performance indicators
4. Stable export supply chain serving global industrial customers
5. Standardized production line to guarantee consistent fast delivery

Frequently Asked Questions

  1. 1. Q: What is the MOQ for custom quartz wafers?
    A: Ultra-low MOQ support, single prototype wafers can be supplied for lab mask research without mass batch limits.
    2. Q: Can you produce quartz wafers according to customer CAD specifications?
    A: Our semiconductor optical team accepts 2D/3D CAD drawings, offers free technical evaluation and 24-hour formal quotation.
    3. Q: What is the difference between DSP and SSP polished quartz wafers?
    A: DSP double-side polished for high-precision photomasks; SSP single-side polished for cost-effective general MEMS substrates.
    4. Which grade quartz wafer is suitable for deep UV photolithography?
    A: JGS1 deep UV grade is the standard material for 193nm/248nm lithography mask wafers.
    5. Q: Are quartz wafers suitable for high vacuum semiconductor production lines?
    A: Ultra-high purity fused silica delivers extremely low outgassing, fully compliant with wafer fabrication vacuum environments.
    6. Q: What is the minimum customizable thickness of quartz wafer?
    A: Minimum thickness reaches 0.1mm with stress-free polishing to avoid warpage.
    7. Q: What is the maximum continuous working temperature of quartz wafer?
    A: Stable long-term operation at 1100°C, resistant to rapid thermal cycling.
    8. Q: Can AR anti-reflection coating be applied on quartz wafer surfaces?
    A: Single or double-sided AR coating is available to maximize UV light transmittance.
    9. Q: What TTV flatness standard can your quartz wafers reach?
    A: Ultra-precision TTV ≤3μm to meet strict semiconductor lithography accuracy requirements.
    10. Q: What standard wafer diameters do you have in stock?
    A: 2/3/4/6/8/12-inch standard sizes, custom special diameters are available upon request.




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