Quartz Wafer
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DSP & SSP Polished High‑Purity Fused Silica Quartz Wafers
“We source JGS1 quartz wafers for our lithography prototype setup, tight TTV and flatness meet our semiconductor lab requirements.”
— Senior Procurement, Semiconductor Photolithography Lab
Hong Kong Felix Optical Glass Co., Limited is a professional custom quartz wafer manufacturer and OEM optical quartz fabrication supplier, supplying semiconductor‑grade precision optical quartz components for photolithography equipment manufacturers, MEMS R&D labs and mask production factories globally. Our quartz wafers are fabricated from 99.99% high purity fused silica with JGS1/JGS2/JGS3 grades, supporting single‑side polished (SSP) and double‑side polished (DSP).
Key Advantages of Our Quartz Wafer
- Raw material: 99.99% ultra‑high purity fused silica, optional BK7, K9 optical glass substrate
- Deep UV to infrared broadband transmission for lithography & inspection equipment
- Ultra‑low CTE, minimum deformation under wide temperature fluctuation
- Ultra‑low TTV, flatness up to λ/10, meets strict semiconductor standards
- Low outgassing property, stable performance in high vacuum production environment
- Custom CNC shaping, edge chamfer, single/double side AR coating available
Engineering Specifications
| Core Materials | Fused Silica(JGS1/JGS2/JGS3), BK7, K9 Optical Glass |
|---|---|
| SiO₂ Purity | ≥99.99% |
| Standard Diameter | 2”, 3”, 4”, 6”, 8”, 12”, custom sizes available |
| Thickness Range | 0.1mm–6.35mm ultra‑thin customizable |
| Surface Polish | SSP Single Side Polished / DSP Double Side Polished |
| Surface Quality | 60/40, 40/20, 20/10 MIL optical finish |
| Flatness | λ/2, λ/4, λ/10 @632.8nm |
| Transmission Range | 185 nm – 3500 nm deep UV to infrared |
| Continuous Working Temperature | Max 1100℃ continuous service |
| CTE | 5.5 × 10⁻⁷ /℃ ultra‑low thermal expansion |
| TTV | ≤3μm ultra‑low total thickness variation |
| Tolerance | Diameter ±0.05mm, thickness ±0.02mm |
| Custom Service | Edge chamfer, AR coating, marking, special profiling |
Typical Application Fields
Semiconductor Photolithography
Photomask substrates for lithography exposure equipment.
MEMS & UV‑Optical R&D
MEMS chips, UV exposure and optical inspection systems.
Metrology & Aerospace
High‑precision instruments, aerospace UV optical sensing components.
- Laboratory spectroscopy & electrochemical testing equipment
- Photovoltaic silicon wafer detection instruments
- Microfluidic chips and biomedical analytical devices
Manufacturing & Quality Control
In‑House Precision Machining
Full‑process CNC, grinding, polishing and coating for quartz wafer production.
Strict Metrology Inspection
Flatness, TTV and surface quality testing to meet semiconductor specifications.
Frequently Asked Questions
Q: What is the MOQ for custom quartz wafers?
A: Ultra‑low MOQ support, single prototype wafers can be supplied for lab mask research without mass batch limits.
Q: Can you produce quartz wafers according to customer CAD specifications?
A: Our semiconductor optical team accepts 2D/3D CAD drawings, offers free technical evaluation and 24‑hour formal quotation.
Q: What is the difference between DSP and SSP polished quartz wafers?
A: DSP double‑side polished for high‑precision photomasks; SSP single‑side polished for cost‑effective general MEMS substrates.
Q: Which grade quartz wafer fits deep UV photolithography?
A: JGS1 deep UV grade is the standard material for 193nm/248nm lithography mask wafers.
Q: Are quartz wafers suitable for high vacuum semiconductor production lines?
A: Ultra‑high purity fused silica delivers extremely low outgassing, fully compliant with wafer fabrication vacuum environments.
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Please provide drawings, dimensions, surface flatness and coating demands. Our optical engineers will send detailed technical proposal and price quickly.