Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor, Photolithography & UV Optics
Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor, Photolithography & UV Optics
Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor, Photolithography & UV Optics
Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor, Photolithography & UV Optics
Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor, Photolithography & UV Optics
Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor, Photolithography & UV Optics
Model
FG-QT-005

Item specifics

Material
High‑Purity Fused Silica (Amorphous SiO₂)
SiO₂ Purity
≥99.99%
Diameter
2″, 3″, 4″, 6″, 8″, 12″ (custom available)
Thickness
0.1 mm – 5 mm (custom thickness)
TTV (Total Thickness Variation)
≤5 μm (high precision ≤1 μm)
Surface Quality
60/40, 40/20, 20/10 (MIL‑STD)
Surface Roughness (Ra)
≤1 nm (DSP), ≤2 μm (lapped)
Optical Flatness
λ/2, λ/4, λ/10 @ 633 nm
Parallelism
<30 arcsec
Transmittance Range
185 nm – 3500 nm
Average Transmittance
>90%
Thermal Expansion Coefficient
5.5 × 10⁻⁷ /°C
Instant Temp Resistance
1300°C
Available Finishes
DSP (double‑side polished), SSP (single‑side polished), lapped
Optional Features
Notch, flat edge, drilling, coating (AR/UV/IR)

Review

Description

Quartz Wafer Manufacturer | Fused Silica Wafers for Semiconductor & Optics

Felix Glass is a professional quartz wafer manufacturer and supplier specializing in high-purity fused silica wafers for semiconductor, photolithography, UV optics, MEMS and laboratory applications. Produced from ≥99.99% SiO₂ fused quartz, our quartz wafers deliver ultra-low thermal expansion, exceptional UV–IR transmittance, high surface flatness and outstanding chemical stability.
 
Available in JGS1, JGS2 and JGS3 grades, with single‑side polished (SSP) or double‑side polished (DSP) finishes, our wafers support 2″–12″ diameters and ultra‑thin profiles down to 0.1 mm, meeting strict MIL‑STD and semiconductor‑level precision requirements.
 
 
 
Technical Specifications
 
PropertyValue
MaterialHigh‑Purity Fused Silica (Amorphous SiO₂)
SiO₂ Purity≥99.99%
Diameter2″, 3″, 4″, 6″, 8″, 12″ (custom available)
Thickness0.1 mm – 5 mm (custom thickness)
TTV (Total Thickness Variation)≤5 μm (high precision ≤1 μm)
Surface Quality60/40, 40/20, 20/10 (MIL‑STD)
Surface Roughness (Ra)≤1 nm (DSP), ≤2 μm (lapped)
Optical Flatnessλ/2, λ/4, λ/10 @ 633 nm
Parallelism<30 arcsec
Transmittance Range185 nm – 3500 nm
Average Transmittance>90%
Thermal Expansion Coefficient5.5 × 10⁻⁷ /°C
Continuous Working Temp1100°C
Instant Temp Resistance1300°C
Available FinishesDSP (double‑side polished), SSP (single‑side polished), lapped
Optional FeaturesNotch, flat edge, drilling, coating (AR/UV/IR)

 
 
 
Product Types
 
JGS1 Deep UV Quartz Wafer
 
- Wavelength: 185 nm – 2500 nm
- Features: Superior deep‑UV transmittance, low OH content
- Applications: Excimer laser, photolithography (193 nm), DUV sterilization, semiconductor mask substrates
 
JGS2 General UV Quartz Wafer
 
- Wavelength: 220 nm – 2500 nm
- Features: Cost‑effective, high uniformity
- Applications: UV curing, optical windows, laboratory substrates, MEMS, inspection systems
 
JGS3 Infrared Quartz Wafer
 
- Wavelength: 260 nm – 3500 nm
- Features: Excellent IR transmission, high‑temperature stability
- Applications: IR imaging, thermal sensing, high‑temp process wafers, aerospace optics
 
 
 
Key Features
 
Ultra‑High Purity & Low Defects
 
- ≥99.99% SiO₂, minimal bubbles, inclusions or striae
- Low metal impurities, ideal for high‑cleanliness semiconductor processes
 
Superior Thermal Stability
 
- Near‑zero thermal expansion, resistant to thermal shock and cycling
- Stable at 1100°C continuous, 1300°C instant
 
Excellent UV–IR Transmission
 
- High transmittance from deep UV to mid‑IR
- Critical for photolithography, laser and IR systems
 
High Precision & Flatness
 
- TTV ≤1 μm available; λ/10 flatness for high‑end optics
- DSP polishing (Ra <1 nm) for mask and wafer bonding applications
 
Chemical Inertness
 
- Resists acids, alkalis and most solvents
- Compatible with semiconductor wet processing
 
 
 
Applications
 
- Semiconductor photolithography mask substrates
- Wafer‑level packaging (WLP) & MEMS
- UV laser systems & excimer laser optics
- High‑temperature process chambers & dummy wafers
- Infrared imaging & thermal sensing components
- Laboratory analytical instruments & optical metrology
- Aerospace & defense optical windows
- Photomask blanks & EUV/UV optics
 
 
 
Custom Manufacturing Services
 
Felix Glass provides full OEM/ODM quartz wafer solutions:
 
- Custom diameters (2″–12″) & thicknesses (0.1 mm+)
- DSP/SSP polishing, lapping & edge treatment (notch/flat)
- Precision drilling, slotting & micro‑machining
- AR, UV anti‑reflection & IR transmission coatings
- Tight TTV/flatness tolerances for semiconductor grades
- Small prototypes & mass production supported
 
 
 
Why Choose Felix Glass
 
- Professional quartz wafer manufacturer with 15+ years export experience
- ISO 9001 certified, strict MIL‑STD & semiconductor‑grade QC
- Full JGS1/JGS2/JGS3 product line, high consistency
- Advanced polishing & metrology (interferometer, surface profiler)
- Fast sampling, short lead time & stable bulk supply
- Global delivery for EU/US semiconductor & optical clients
 
 
 
FAQ
 
What is a quartz wafer?
A quartz wafer is a thin, flat fused silica disc made of high‑purity SiO₂, precision polished for semiconductor, optical and MEMS applications。
 
Quartz wafer vs. silicon wafer — key difference?
Quartz offers UV transparency, much lower thermal expansion and better high‑temp stability; silicon is opaque in UV and has higher CTE。
 
What grades do you offer?
JGS1 (deep UV)、JGS2 (general UV)、JGS3 (infrared)。
 
What sizes are available?
Standard 2″, 3″, 4″, 6″, 8″, 12″; custom diameters on request。
 
Do you provide double‑side polished (DSP) wafers?
Yes. DSP (Ra <1 nm) and SSP options available。
 
What is TTV?
Total Thickness Variation — smaller values (≤1 μm) mean higher thickness uniformity, critical for lithography。
 
Can you make ultra‑thin quartz wafers?
Yes, down to 0.1 mm thickness with strict tolerances。
 
Are coatings available?
Yes: AR, UV and IR coatings。
 
Do you support semiconductor‑level quality?
Yes, with low TTV, high flatness, low defects and documented inspection reports。
 
Can I get samples?
Yes, samples available for qualification before volume production。
 
 
 
Related Products

 
 
Request a Quote
 
Contact Felix Glass today for free technical consultation, custom quartz wafer solutions and factory pricing. Our engineering team supports your semiconductor, photolithography and optical projects worldwide.